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2019. 12. 16.
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2019. 12. 16. Àüü±Û: 43 ¹æ¹®¼ö: 35616
56
19.10.16~18 (±¹³») TCT KOREA 2019
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210
55
19.05.15~17 (±¹³») SMT/PCB& NEPCON KOREA 2019
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180
54
19.04.04~05 (±¹³») Ãá°è ´ëÇѱݼÓÀç·áÇÐȸ
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167
53
18.11.12~14 (±¹³») Ãß°è ºÐ¸»¾ß±ÝÇÐȸ
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163
52
18.10.24~26 (±¹³») Ãß°è ±Ý¼ÓÀç·áÇÐȸ
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123
51
18.10.31~11.04 (ÇØ¿Ü) JIMTOF 2018
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127
50
18.07.01~06 (ÇØ¿Ü) ISNNM 2018
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126
49
18.06.05~07 (ÇØ¿Ü) PCIM
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126
41
18.04.11~13 (±¹³») NEPCON KOREA 2018
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123
40
18.04.05~06 (±¹³») Ãá°è ºÐ¸»¾ß±ÝÇÐȸ
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122
39
17.10.25~27 (±¹³») Ãß°è ´ëÇѱݼÓÀç·áÇÐȸ
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127
38
17.11.01~03 (±¹³») Ãß°è ºÐ¸»¾ß±ÝÇÐȸ
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124
37
17.09.18~23 (ÇØ¿Ü) EMO
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132
36
17.09.14~16 (±¹³») 3DÇÁ¸°ÆÃ °¥¶ó in ¿ï»ê
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137
35
17.05.16~18 (ÇØ¿Ü) PCIM
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139
30
17.4.6~7 (±¹³») Ãá°è ºÐ¸»¾ß±ÝÇÐȸ
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932
29
17.3.7~11 (±¹³») Intermold Korea 2017
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815
28
16.5.11~13 (±¹³») (»ç)Çѱ¹Á¤¹Ð°øÇÐȸ Ãá°è Çмú´ëȸ
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1230
27
16.5.10~12 (ÇØ¿Ü) µ¶ÀÏ PCIM
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1338
26
16.3.31~4.1 (±¹³») Ãá°è ºÐ¸»¾ß±ÝÇÐȸ
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1065
25
16.4.13~17 (±¹³») SIMTOS 2016
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1107
24
16.1.13~15 (ÇØ¿Ü) 2016 NEPCON JAPAN
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985
23
15.11.17~20 Formnext
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1045
22
15.11.10~13 Productronica
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1053
21
15.06.16~20 Therm process
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1061
20
15.05.19~21 PCIM
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1046
19
15.04.02~04 KPMA
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980
18
15.03.01~03 OZ-15
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983
17
15.02.04~06 Semicon Korea
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979
15
14.10.30~11.04 (ÇØ¿Ü) ÀϺ» JIMTOF
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1612
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